The Breakthrough Pulsar™
Wafer Cleaning System
Pulsar™ single wafer systems have been designed to provide the leading-edge wafer cleaning and surface preparation essential for the most advanced integrated circuit manufacturing.
Unique key attributes include:
- A proprietary cleaning process, enabled by the wafer’s vertical orientation and the gasless hydraulic pulsation of jetted fluids onto its surface, which exploits natural gravitational forces and employs high velocity shearing
- Extraordinary damage-free cleaning with high defect removal efficiency, even at the most advanced process nodes
- An innovative patented chamber design which allows scaling to 450mm without increasing the footprint of our 300mm process chamber
- Usage of multiple dilute chemistries in a single chamber for photoresist strip and clean applications