The Pulsar™ 3000 – now ready for mass production – stands alone in successfully resolving several yield, cost and technical challenges now affecting production fabs processing wafers at 32nm and smaller (“advanced”) geometries.
- High efficiency damage-free cleaning of all surfaces of 300mm wafer simultaneously
- Photoresist strip and cleaning in same chamber
- Via and trench cleaning
- Yield enhancement
- Advanced recipe management and control of overlapping pulsed jets to maximize strip and cleaning efficiency
- Wafer reworking to enhance lot production yield
- Designed for ease of maintenance and service